MT6628QP Competitive Analysis Report
Structural analysis report offers valuable intelligence on IC technology, market research, package and die information and cross-sectional views and diagram to reveal the process flow and the structural advantage of the design.
Price:¥ 1000.00

Table of Contents

  • Package Photo & Size

  • Device Summary

  • Die Information

    • Die Photo

    • Die Thickness

    • Die Process Gate Size

  • Cross-Section

    • Pad Size

    • Metal & Via Size

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