MSM8939 Competitive Analysis Report
2016-1-28
Structural analysis report offers valuable intelligence on IC technology, market research, package and die information and cross-sectional views and diagram to reveal the process flow and the structural advantage of the design.
Price:¥ 1000.00

Table of Contents

  • Device Summary

    • Information Table

  • Package Overview

    • Top

    • Bottom

    • X-Ray

    • Ball

    • Bump

    • PCB Analysis

  • Package Cross Section

    • Package Thickness

    • Metal Thickness

    • PP & Core

    • Via

  • Die Information

    • Die Photo

    • Pad Size

  • Die Analysis

    • Region Analysis

    • General Structure

    • Gate Length

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