SHTC1 MEMS Structure Analysis Report
2016-1-28
Structural analysis report offers valuable intelligence on IC technology, market research, package and die information and cross-sectional views and diagram to reveal the process flow and the structural advantage of the design.
Price:¥ 1800.00

Table of Contents

  • Market Analysis

    • Sensirion Introduction

    • Sensirion Products

    • Sensor Comparison

  • Device Summary

  • Package Overview

    • Top

    • Bottom

    • Side

    • Decap

  • Die Information

    • Die Photo

    • Corner

    • Size

    • Marking

  • Package Analysis

    • Overview

    • Detector

    • Material Analysis

  • Die Analysis

    • Functional Layout

    • Microscope Photo

    • Die Cross Section

  • RH Sensor Analysis

    • Sensor Size

    • Microscope Photo

    • Die Cross Section

  • Major Findings

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