HTPA16x16dl2.1 Heimann Sensor Process Analysis Report
2016-1-28
Structural analysis report offers valuable intelligence on IC technology, market research, package and die information and cross-sectional views and diagram to reveal the process flow and the structural advantage of the design.
Price:¥ 1800.00

Table of Contents

  • Device Summary

  • Package

    • Decap

    • Mlx90670

    • 24AA02

    • Mlx90670 Mark

    • 24AA02 Mark

  • Mlx90670 Information

    • Overview

    • Side1 & Side2

    • Sensor Features

    • Sensor Back

  • Mlx90670 Process

  • Sensor Cross Section

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