Apple iPhone 6 Plus Smartphone Full Teardown Analysis Report
2016/11/22
Full teardown analysis report offers detailed product disassembly analysis and in-depth information at system, functional module and component level. It provides package, block diagram, UI, construction, benchmarking and cost estimation with illustration and graphics.
Price:¥ 20000.00

Table of Contents

  • Product Overview

    • Design Highlight

    • Overview

  • Block Diagram

  • Product Package

    • Outer Package

  • UI Overview

  • Exterior Feature

    • Front

    • Back

    • Side 1

    • Side 2

  • Main Components

    • Major Components Side 1

    • Major Components Side 2

    • Components Arrangement

  • Assembly Instruction

    • Assembly Step

  • Mainboard

    • Connector

    • Modules

    • Function Layout

    • IC Location

    • Process

  • Antenna

    • Overview

    • GPS/Bluetooth/Wi-Fi Antenna

    • Main Antenna

  • Battery

    • Overview

    • Disassembled

    • IC Identification

    • Information

  • Camera

    • Overview

    • Disassembled

    • IC Identification

  • Display

    • Overview

    • Side1 & Side2

    • Disassembled

    • Screen Side1 & Side2

    • Information

  • Components Statistics

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