Samsung-Galaxy S6 Edge+ Smartphone Full Teardown Analysis Report
2016/11/22
Full teardown analysis report offers detailed product disassembly analysis and in-depth information at system, functional module and component level. It provides package, block diagram, UI, construction, benchmarking and cost estimation with illustration and graphics.
Price:¥ 20000.00

Table of Contents

  • Product Overview

    • Design Highlight

    • Overview

  • Block Diagram

  • Product Package

    • Outer Package

    • Supporting Materials

    • Adapter

    • Manual

  • UI Overview

  • Exterior Feature

    • Front

    • Back

    • Side 1

    • Side 2

  • Main Components

    • Major Components Side 1

    • Major Components Side 2

    • Components Arrangement

  • Assembly Instruction

    • Summary

    • Assembly Step

  • Mainboard

    • Connector

    • Modules

    • Function Layout

    • IC Location

    • RF Coaxial Connector

    • RF Switch

    • Test Pad

    • Structure

  • Display

    • Overview

    • Disassembled

    • Stackup

    • IC Identification

    • X-ray

    • Cost

  • Antenna

    • Overview

    • Wi-Fi/Bluetooth/GPS/RxD Antenna

    • Main Antenna

    • NFC/Wireless Charging Coil

  • Battery

    • Overview

    • Disassembled

    • IC Identification

    • Cost

  • Camera

    • Overview

    • Disassembled

    • Components Arrangement

    • IC Identification

    • Die Photo

    • X-ray & Process

  • Flex

    • Docking Board Flex

    • Home Key Flex

    • ALS/Proximity Sensor/Microphone/Notify LED Flex

  • Components Statistics

    • Total Cost

    • Assembly Part

    • ICs

    • Sub ICs

    • Module

    • Discretes-Active

    • Discretes-Passive

    • Connectors

    • Substrates

    • Non-Electronics

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