Xiaomi - 5s Plus

015 -Samsung
KLUCG4J1CB
eMMC-32GB NAND FLASH
014 -Qualcomm
PM8996
Power Management
013 -Qualcomm
MSM8996
Pop-2 chip:Qualcomm Snapdragon 821 Quad-core Application and Baseband Processor
012 -Samsung
K3RG2G20BMMGCJ
Pop-1 chip:4GB LPDDR4 SDRAM
011 -STMicroelectronics
LSM6DS3
6-Axis (Gyroscope+Accelerometer)
010 -Qualcomm
SMB1351
Quick Charge 3.0 Chip
008 -Qualcomm
QFE3100
Envelope Tracker
007 -Avago
ACPM-7800
UMTS Power Amplifier Module
006 -Skyworks
SKY77824-11
Power Amplifier Module For FDD LTE
003 -NXP
67T07
NFC Controller
002 -AKM
AK09915
3-Axis Electronic Compass
001 -Bosch
BMP280
Barometer Sensor
026 -Skyworks
SKY13492
Antenna Switch
025 -Qualcomm
WTR3925
RF Transceivers for 2G, 3G and 4G LTE
024 -RFMD
RF6093
Antenna Switch
023 -Qualcomm
QCA6164A
WiFi,Bluetooth,NFC
022 -QORVO
QFP8538
Wi-Fi Front End Module 4900MHz to 5925MHz
021 -QORVO
RFFM8538
2.4 GHz/5 GHz Wi-Fi FEM
020 -Qualcomm
WSA8815
Speaker Amplifiers
019 -Qualcomm
PMI8996
Power Management
018 -Knowles
Microphone
017 -Knowles
Microphone
016 -Qualcomm
WCD9335
Audio Codec
Part Info
Part Number
Type PCB
Marking 3501B07M00A 520B70 010000 4G 64G 80643Y 004758 RU IEB HT2 MI V-0 104 6380050
Assembly Name Mainboard
Core Material
Substrate Technology
Layers Count 10
BlindViaLand Diameter
BlindViaHole Diameter
ThruViaLand Diameter
ThruViaHole Diameter
Area
Min Trace Pitch
Min Trace Width
Thickness 0.72
Manufacturer
沪ICP备13021560号-1
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